Subject: | |
From: | |
Reply To: | (Combined Forum of D-33a and 7-31a Subcommittees) |
Date: | Fri, 5 Aug 2005 16:35:43 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Mike
Going back to my old AT&T days, 500F was actually typical,especially with OSPs. I have also been in several OEM and CM facilities where the wave solder pot is at 500F.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: Michael E. Hill<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Friday, August 05, 2005 11:35 AM
Subject: Re: [IPC-600-6012] "Typical" Wave Soldering Temperatures
Happy Friday everyone!
Constantino J. González and 610 committee,
I have an assembly question that I could use some help.
What is the "normal" (or "normal range") wave soldering temperature used
for standard 60/40 solder?
Note: I have a customer that is getting some minor lifted lands with
Hi-Temperature FR4 (170C) multilayers and they are using 500F for the pot
temperature. I checked with two assembly houses and they both use 485F. I
thought 500F was a little on the high side. The boards are all through hole
technology .062 to .073 inch thick. The foil bond strength to epoxy is 2.5
to 2.8 pounds per inch.
Please let me know what wave soldering temperatures are generally used and
any comments.
thanks
Mike Hill
|
|
|