Hello here is Constantino J. Gonzalez from ACME, Inc. – Chairman of
IPC-A-610 Committee and one of my customers had a question. 
Need your assistance on below ... 

boards are failing for boot up / intermittent boot up with certain fallout
rate and Burn-in failures.

Affected location : U6 & U3 ( BGA) sent 2 board to 3rd party lab for a
failure analysis. ( report as attached) 

-As you can see  the solder joints looks  good. 
-There was no evidence of black pad . 
- Double plating on via hole with "cobblestone" appearance on the 1st
plating. 
-CU Wicking 

I wondering why the hole wall structure has "Cobblestone" appearance? 
Is this acceptable ?? 
We are unable to perform plating analysis as we don't have any more raw
cards. 
Can Cu wicking, lead to boot up failure?? 
Is there any other analysis that can be perform ?? 

What is your opinion ?? 
Appreciate your help. 

 

ACME F

 

Regards from your,

Official IPC MASTER INSTRUCTOR

 

Constantino J. González

President / Consultant Engineer

IPC-A-610 Committee Chairman

 

ACME, Inc.

AMERICAN-HISPANIC COMPANY

513 CLEVELAND STREET

RAPID CITY, SOUTH DAKOTA 57701

USA

E-mail: [log in to unmask]

Phone: 605-381-5963

Fax:    605-341-4261