Our manufacturing spec calls for wave soldering at 230C for 63/37 solder and 260C for Pb-free soldering.

I thought copper peel strength was typically 8-12 pounds per inch.  Your comment of 2.5 to 2.8 seems way too low.

Thanks,

W. Glenn Colescott


Component Line Leader - PCBs & Substrates
Component Engineering Liaison Manager - North America
Delphi Electronics & Safety Division
One Corporate Center - Mail Station R117

P.O. Box 9005

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Phone; (765)-451-1258 FAX; (765)-451-9647

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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]]On Behalf Of Michael E.
Hill
Sent: Friday, August 05, 2005 10:36 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] "Typical" Wave Soldering Temperatures


Happy Friday everyone!

Constantino J. González and 610 committee,



I have an assembly question that I could use some help.


 What is the "normal" (or "normal range") wave soldering temperature used
for standard 60/40 solder?


Note: I have a customer that is getting some minor lifted lands with
Hi-Temperature FR4 (170C) multilayers and they are using 500F for the pot
temperature. I checked with two assembly houses and they both use 485F.  I
thought 500F was a little on the high side. The boards are all through hole
technology .062 to .073 inch thick. The foil bond strength to epoxy is 2.5
to 2.8 pounds per inch.


Please let me know what wave soldering temperatures are generally used and
any comments.

thanks
Mike Hill

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