IPC-600-6012 Archives

August 2005

IPC-600-6012@IPC.ORG

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Subject:
From:
"Michael E. Hill" <[log in to unmask]>
Reply To:
(Combined Forum of D-33a and 7-31a Subcommittees)
Date:
Fri, 5 Aug 2005 11:35:42 -0400
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Happy Friday everyone!

Constantino J. González and 610 committee,



I have an assembly question that I could use some help.


 What is the "normal" (or "normal range") wave soldering temperature used
for standard 60/40 solder?


Note: I have a customer that is getting some minor lifted lands with
Hi-Temperature FR4 (170C) multilayers and they are using 500F for the pot
temperature. I checked with two assembly houses and they both use 485F.  I
thought 500F was a little on the high side. The boards are all through hole
technology .062 to .073 inch thick. The foil bond strength to epoxy is 2.5
to 2.8 pounds per inch.


Please let me know what wave soldering temperatures are generally used and
any comments.

thanks
Mike Hill

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