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August 2005

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Subject:
Re: Blistering of PCB at lead-free temperatures
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 25 Aug 2005 22:26:37 EDT
Content-Type:
text/plain
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text/plain (29 lines) 
Hi Ioan,
I sent this earlier munder a different heading:
Tg is not the whole story, you also need to  look at Td [decomposition 
temerature] as well as the CTE. I recommend PCB materials with a STII [Soldering 
temperature impact index] of at least 215. The STII is defined as

STII= [Tg + Td]/2 - [% thermal expansion from 50 to 260 C]x10

You may be interested in my workshop on PCB reliability at NPL on October 13.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com

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