Richard:
I am glad that you are sharing this info with everyone else. I
think the US cleaning is fantastic. It really removes particles that
other wise would take a lot of chemicals or mechanical scrub. Maybe it
will be used as a standard cleaning someday and save the industry lots
of money.
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
Sent: Wednesday, August 03, 2005 10:07 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Ramon,
It is of a different frequency. When I first purchased it, I bought it
from Crest Ultrasonics in North Dakota. The tech rep was very
knowledgeable. He told me that it operated at a different frequency from
the Branson units, and it would not harm (or be less likely to harm) the
components. I do not recall the frequency, but I am sure they can pass
that info on. An excellent article was written about this and is listed
in the American Competitiveness Institute (ACI) archives available
online. I purchased these Crest units for two companies I used to work
for, and I was told that they have been working extremely well. It has
now been 4 years since I purchased the first unit.
What did you mean by "US cleaning is a noon for PWAs"?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Wednesday, August 03, 2005 8:34 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Hi Richard:
I have known from different sources including this forum that US
cleaning is a noon for PWAs. I read an article from China that they have
developed a US cleaning using a different frequency that does not damage
components of any kind. It seems that your US cleaner might be of the
frequency that does not damage components.
Regards,
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
Sent: Wednesday, August 03, 2005 8:46 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
I actually have component application info from at least two BGA
manufacturers that include US cleaning info, and one (Intel) actually
recommends cleaning with US and a mix of hot de-ionized water mixed with
a saponifier. So I question the statement that US causes cracked solder
joints. I do know that it can damage certain components with a resonant
cavity.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, August 03, 2005 7:39 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Hi Paul! What is the physics behind the ultrasonic cleaning system
causing cracked BGA solder joints? Is your comment based on published
data or internal data?
Dave Hillman
Rockwell Collins
[log in to unmask]
Paul Edwards
<paul@SURFACE-ART
.COM>
To
Sent by: TechNet [log in to unmask]
<[log in to unmask]>
cc
Subject
08/02/2005 09:41 Re: [TN] Question on cleaning
PM boards with BGA.
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Paul Edwards
<paul@SURFACE-ART
.COM>
Never use an ultrasonic cleaning system with BGAs unless you want to
generate cracked solder joints...
Assuming your ECN is at the former label location which is why you need
complete adhesive removal... find out from your label supplier what type
of adhesive they are using and have them suggest something...
We use an alcohol/glycol/water mix to remove most label adhesives...
Paul Edwards
Surface Art Engineering
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
Sent: Tuesday, August 02, 2005 4:58 PM
To: [log in to unmask]
Subject: [TN] Question on cleaning boards with BGA.
We are remanufacturing (reworking some of product) due to an ECR
release. We apply a label with non-conductive adhesive that once
removed leaves adhesive on the PCBA. This adhesive prevents the board
from passing due to not making contact. The current process requires an
operator to use IPA and a soft scrub to remove it. This process is time
consuming. My CM has suggested that we ultrasonic the boards using S-10
solvent.
My boards have BGAs, interconnect pins, and switches along with the
normal SMT parts. Will using this s-10 solvent in an ultrasonic cleaner
work, and will it not cause any reliability issues with BGAs or other
parts on the boards?
Anyone have any other suggestions for auto cleaning my boards to remove
the adhesive. We use the no clean process.
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