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August 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 17 Aug 2005 17:05:21 -0400
Content-Type:
text/plain
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text/plain (63 lines)
When you solder to a ENIG pad the gold becomes dissolved in the solder
and the bond is to the NI layer.  If you supplier were to strip off the
solder you would see a neat nickel pad without gold.  Sometimes you can
reactivate the NI and try IG again, but the result is generally not
100%.

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tom Moore
Sent: Wednesday, August 17, 2005 3:38 PM
To: [log in to unmask]
Subject: [TN] HASL over nickel

Our PC board supplier inadvertently supplied us with boards composed of
gold over nickel rather than the specified HASL finish. While we kept
some
of the boards to keep our production line running, we sent the rest back
to
have the gold stripped off and run through the HASl process. Now our
supplier is telling us that they will not be able to remove the nickel
that
has bonded to the copper pads. I'm going to have the supplier guarantee
the
board life in blood, but I would feel more confident in having
confirmation
by this group's expertise. Thanks for your help.

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