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Date: | Wed, 17 Aug 2005 13:12:49 -0700 |
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Which works for a plating process, not too sure if the same applies where
the nickel is happily oxidising all of the time it is out of a plating tank.
John
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Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Scott B. Westheimer
Sent: Wednesday, August 17, 2005 1:01 PM
To: [log in to unmask]
Subject: Re: [TN] HASL over nickel
The was actually a process back in the 70's called RLM. For you that worked
in Silicon Valley back then it stood for Robert L Mac the owner of Santa
Clara Circuits who had the process patented. It was a nickel plated board
that was then covered completed with screen ink, sorry no dry film back
then, except for the pads and then tin leaded plated and reflowed. Was there
any issues? Not sure but there was a lot of boards made that way, for
several years.
Scott B. Westheimer
Colonial Circuits
----- Original Message -----
From: "Tom Moore" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, August 17, 2005 3:38 PM
Subject: [TN] HASL over nickel
> Our PC board supplier inadvertently supplied us with boards composed of
> gold over nickel rather than the specified HASL finish. While we kept some
> of the boards to keep our production line running, we sent the rest back
> to
> have the gold stripped off and run through the HASl process. Now our
> supplier is telling us that they will not be able to remove the nickel
> that
> has bonded to the copper pads. I'm going to have the supplier guarantee
> the
> board life in blood, but I would feel more confident in having
> confirmation
> by this group's expertise. Thanks for your help.
>
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