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August 2005

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Subject:
From:
Edward Szpruch <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Edward Szpruch <[log in to unmask]>
Date:
Tue, 16 Aug 2005 08:47:16 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (119 lines)
Hi all,
It was cleary stated, that the key to avoinding of Black Pad is "Good
Process Control of ENIG" . Thickness limitations on Gold thickness is just
small addition.
With bad Process Control , especially in Nickel Stage, Black Pads will occur
even with Gold thickness between 0.05 to 0.1 micron.
Edward


> -----Original Message-----
> From: James Hofer [SMTP:[log in to unmask]]
> Sent: б аевеси 15 2005 21:43
> To:   [log in to unmask]
> Subject:      Re: [TN] osp vs ENIG
> 
> I too would like that documentation. And I would ask the question "are all
> of Uyemura customers notified of this possible elimination and therefore
> abide by the 2 to 4"?
> James
> 
> ----- Original Message -----
> From: "Stadem, Richard" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, August 15, 2005 8:57 AM
> Subject: Re: [TN] osp vs ENIG
> 
> 
> Thanks, George. This is good information. Can you provide documentation
> or data regarding the 2-4 uins of gold killing the BP problem?
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of George Milad
> Sent: Monday, August 15, 2005 8:39 AM
> To: [log in to unmask]
> Subject: Re: [TN] osp vs ENIG
> 
> ENIG is the number one choice for a contacting surface.
> At the IPC Plating Committee round robin testing with ENIG as a contact
> surface indicated >1000,000 actuations without any change in
> resistivity.
> 
> With good process control ENIG is free of "Black Pad" issues. The new
> IPC ENIG specifications 4553, that specifies less immersion gold (2-4
> uins) has virtually eliminated BP.
> 
> Do we stop using electroless copper because of occasional voiding, or
> inner layer separation?
> 
> Do we stop using electrolytic copper because we occasionally have copper
> cracks?
> 
> Do we stop etching because of oevr hang and undercut?
> 
> PCB manufacturing is all about "PROCESS CONTROL"
> ENIG is no different.
> 
> I agree that Immersion Silver has a lot of potential as a finish  also.
> 
> Best  regards
> 
> George Milad
> [log in to unmask]
> National Accounts Manager  for Technology Uyemura International
> Corporation Technical Center 240  Town LIne Rd Southington CT 06489
> (516) 901 3874 (mobile)
> (860)  793-4011 (office)
> (860) 793-4020 (fax)
> 
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