Hmmmmmmmmmmm thats an interesting remark Dewey
"have not been able to send anything out lately"
So tell me what IS the finish on the network interface card in your
PC................8-)
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: Whittaker, Dewey (AZ75) [mailto:[log in to unmask]]
Sent: Thursday, August 11, 2005 1:23 PM
To: TechNet E-Mail Forum; John Burke
Subject: RE: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.
That remark was very vanilla in nature. Much to your happiness I have
not been able to send anything out lately. I don't even know if you'll
get this, but there's no sense crying over frozen milk. I did have a few
good ones on the brush question.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, August 11, 2005 1:16 PM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.
Yup.......................
Lets change the chemistry topic...............Ice cream anyone??
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
Fremont
CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
------------------------------------
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Thursday, August 11, 2005 1:09 PM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.
It must be Friday for some of us:)
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Ball
Sent: Thursday, August 11, 2005 2:48 PM
To: [log in to unmask]
Subject: Re: [TN] <Misc>Re: [TN] <Misc>Re: [TN] RoHs board surface
recommendations.
......unnnnh........no tail.......wife..........must
resist.........arrrrgh....
Steve Hodge
<[log in to unmask]> To:
[log in to unmask]
Sent by: TechNet cc:
<[log in to unmask]> Subject: Re:
[TN] <Misc>Re: [TN]
<Misc>Re:
[TN] RoHs board surface
08/11/2005 03:36 PM recommendations.
Please respond to TechNet
E-Mail Forum; Please
respond to Steve Hodge
George, I am sorry you feel you have to downgrade my opinion as being a
sales pitch or "wife's tail". I am stating data -substantiated facts and
I could care less about selling something to you or anyone else. A
wife's tail? What? My wife does not have a tail. I think it should be
"wive's tale" anyway.
At 12:30 PM 08/11/2005, you wrote:
>John,
>
>Your opinionated! but then too so am I. However, it sounds like our
>opinions are based on data and not "wife's tails" or "sales pitches"
>
>Regards,
>George
>George M. Wenger
>Reliability / FMA Engineer
>Base Station and Subsystems Group
>Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908)
>546-4531 [log in to unmask]
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of John Burke
>Sent: Thursday, August 11, 2005 2:16 PM
>To: [log in to unmask]
>Subject: Re: [TN] <Misc>Re: [TN] RoHs board surface recommendations.
>
>
>Very nice,
>
>Until you consider that ENIG infringes the design rules for at least
>one
of
>the top 3 global CM's due to the issues associated with it.
>
>If you want the number of their chief technologist who has to look at
enigma
>failures week in week out I will happily supply details off line.
>
>I personally have built hundreds of thousands of assemblies on ENIG as
well
>as Immersion AG.
>
>As for the rest, HASL is generally failure related to a complete lack
>of understanding of tin thickness and intermetallic growth rate, OSP
>failures generally are related to not understanding the degradation of
>that finish with multiple reflow cycling, and personally I would never
>use immersion
tin
>without some type of diffusion barrier between it and the copper if nay
time
>in storage was to be considered.
>
>The ENIG when it fails can be catastrophic............and in most cases
can
>be pointed back to the process at the fab house rather than what
>happened
to
>it during the assembly process, unlike most of the other finish
>defects,
and
>has to my knowledge resulted in multi million dollar lawsuits between
>companies in the bay area due to failures.
>
>If it doesn't fail - it is fine, but the joint shear strength is less
>than the equivalent HASL or immersion AG finish due to the Tin
>nickel/nickel copper crystalline structure, so taking into
>consideration the higher temperatures of lead free I would be vary
>careful using it for area array packages using this soldering
technology.
>
>For the record have been using immersion silver since 1996 as I
>produced
the
>first beta site production runs using alpha level, so perhaps my views
have
>a little more history.
>
>Call me opinionated - I'll take it.
>
>John
>
>
>
>
>
>
>
>------------------------------------
>Avanex
>John Burke
>Senior Manager RoHS Compliance
>[log in to unmask]
>40919 Encyclopedia Circle
>Fremont
>CA 94538
>tel: 510 897 4250
>fax: 510 979 0189
>mobile: 510 676 6312
>------------------------------------
>
>
>-----Original Message-----
>From: Steve Hodge [mailto:[log in to unmask]]
>Sent: Thursday, August 11, 2005 10:44 AM
>To: TechNet E-Mail Forum; John Burke
>Subject: Re: <Misc>Re: [TN] RoHs board surface recommendations.
>
>
>John, come on now. Anything can happen at any time. I have seen some
>reservations from the IS users as to silver migration possibilities and
>shelf life/handling issues --you might say they have not seen them
--"yet".
>I have had more problems with HASL, OSP and IT than I have with ENIG.
>ENIG has longer data history than IS, so both shoes have already
>dropped so to speak. Three years without problems, is an eternity in
>this business, especially when we are expected to build custom
products in 24 hours.
>
>
>At 11:00 AM 08/11/2005, you wrote:
> >with it............YET..........
> >
> >------------------------------------
> >Avanex
> >John Burke
> >Senior Manager RoHS Compliance
> >[log in to unmask]
> >40919 Encyclopedia Circle
> >Fremont
> >CA 94538
> >tel: 510 897 4250
> >fax: 510 979 0189
> >mobile: 510 676 6312
> >------------------------------------
> >
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]]On Behalf Of Edwin Louis
> >Sent: Thursday, August 11, 2005 4:48 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >
> >We have been using ENIG now for about three years and have had no bad
> >experiences with it. NASA for one does not allow the use of silver .
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
> >Sent: Wednesday, August 10, 2005 4:57 PM
> >To: [log in to unmask]
> >Subject: Re: [TN] RoHs board surface recommendations.
> >
> >Hi Steve,
> >I do not know about "bad-mouth ENIG"--I am a reliability consultant,
> >and have had plenty of calls because of ENIG related failures, but
> >not a one
about
> >iAg. On the other hand, I do not know about their respective
environmental
> >implications.
> >
> >Regards,
> >Werner Engelmaier
> >Engelmaier Associates, L.C.
> >Electronic Packaging, Interconnection and Reliability Consulting
> >7 Jasmine Run
> >Ormond Beach, FL 32174 USA
> >Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> >E-mail: [log in to unmask], Website: www.engelmaier.com
> >
> >
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