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August 2005

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TechNet E-Mail Forum <[log in to unmask]>, "Kane, Joseph E (US SSA)" <[log in to unmask]>
Date:
Thu, 18 Aug 2005 11:36:42 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
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From:
Jeffrey Bush <[log in to unmask]>
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We have been testing several material types for thermal integrity over
6x288C and IST testing.  The filled systems have been performing well
over the standard FR4 materials.  We are currently undergoing several
qualifications with OEMS on these materials in relation to specific
assembly processes.  I can share the specifics of the test programs and
models with you offline if you like.

The materials are more costly, but they are very similar visually to
their FR4 counterpart at the same manufacturer.  There are also some
manufacturing differences that you may notice if not maintaining a good
control of raw materials.  


Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Joseph E (US
SSA)
Sent: Thursday, August 18, 2005 10:27 AM
To: [log in to unmask]
Subject: [TN] New Resin System

New Phenolic cured epoxy resin systems are being qualified to
IPC-4101/24, 26, and 98 requirements.
Has anyone tested these new materials?  How do you know which material
you are really getting 
(new Phenolic or old DICY cured epoxy resins)?

Joe Kane
BAE SYSTEMS
Johnson City, NY

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