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July 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Fri, 1 Jul 2005 08:01:16 +0200
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text/plain
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text/plain (41 lines)
Ioan,
if I were you, I'd glob the chip before reflowing, in order to avoid flux splatter,contamination in general and not the least handling. 
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
Sent: den 30 juni 2005 16:49
To: [log in to unmask]
Subject: [TN] Is wire bonding reflowable?


Hi Technetters,

a customer of ours is wondering if a module they are ordering will be OK to solder in regular (SnPb for now) reflow. The module has an exposed die, no encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since regular ICs can be reflowed with no issue, this module should not present any hickup.

My exposure to wire bonding is zero, so I take this issue with you. Can this question be answered as is, or would you need more details?

Thanks,
Ioan

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