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July 2005

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Subject:
From:
Gerard O'Brien <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerard O'Brien <[log in to unmask]>
Date:
Fri, 1 Jul 2005 12:40:20 -0400
Content-Type:
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text/plain (46 lines)
I have wetting balance data for same if interested.

Regards


Gerard O'Brien
Photocircuits Corporation


-----Original Message-----
From: Cliff Knudson [mailto:[log in to unmask]]
Sent: Friday, July 01, 2005 11:36 AM
To: [log in to unmask]
Subject: [TN] Wave hole fill silver immersion vs osp with sac solder

I was wondering if anyone would have any comparison data on wetting or
hole fill for wave process using SAC solder comparing osp and immersion
silver surface finishes. Only differences would be surface finishes.

Thanks
Cliff

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