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July 2005

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Subject:
Re: Solder paste short after printing
From:
Mark Austin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mark Austin <[log in to unmask]>
Date:
Tue, 12 Jul 2005 16:13:00 +0100
Content-Type:
text/plain
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text/plain (55 lines) 
Try a print speed of 35 to 40mm/sec and pressure about 7Kg.

The pressure does depend on the size of the board you are printing.

From memory about 0.5Kg per Inch of PCB that is in contact with the squeege.

Mark

===== Original Message from [log in to unmask] (TechNet E-Mail Forum) at
12/07/05 14:07
>Hi guys,
>
>I have one problem here and I need your expertise to help me. Ok recently
>our fine pitch IC (20mils) has shorted/bridged after printing as we change
>from leaded to lead free solder paste. Most of the bridging at the fine
>pitch occurred in parallel to squeegee moving direction. Any suggestion or
>input is greatly appreciated.
>
>Note:
>Squeegee type: metal
>Stencil thickness: laser cut (5mils)
>Solder paste: Kester EM907
>Printer: DEK288
>Separation speed: 2mm/sec
>Printing speed: 25mm/sec
>Squeegee pressure: 8Kg
>
>
>Best Regards,
>Azman
>
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