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July 2005

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Subject:
From:
Chris Ball <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 12 Jul 2005 09:36:39 -0400
Content-Type:
text/plain
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text/plain (163 lines)
The parts are now all dry and wrinkly. -Chris





                       Stephen Gregory
                       <[log in to unmask]        To:   [log in to unmask]
                       OM>                               cc:
                       Sent by: TechNet                  Subject:    [TN] Can somebody decipher
                       <[log in to unmask]>                   this for me?

                       07/12/2005 08:49 AM
                       Please respond to TechNet
                       E-Mail Forum; Please
                       respond to Stephen.Gregory







Mornin' All!

Yesterday, I created two case numbers for technical support at Cypress
Semiconductor.
One to find out whether or not the ceramic (or aluminum oxide) part I had
was moisture
sensitive (I haven't heard back from them yet), and the other was to verify
what the gold
plating thickness is on the leads of the part since it wasn't on the data
sheet.

Below is the text pasted from the email exchange that we had:


 Case number: 2LSUG88


                                                                Created at:



          07/11/2005





                                                                       Part



          Number:5962-9759802QXC

                                                                   Product:



          Programmable Logic > Programmable Logic Devices

                                                                   Subject:



          Gold Plating Thickness on Leads...

                                                               Description:



          I would like to find out what the gold plating thickness is on

          the leads for the part number above.

          J-STD-001 requires that the gold must be removed by a double-dip

          tinning process, or by a single

          dip in a dynamic solder bath if the plating is above a certain

          thickness. I need this information to

          determine whether or not I have to remove the gold prior to board

          assembly.









 Hi Stephen,


 Requested part number 5962-9759802QXC is pruned part. Date of pruning is

 05-may-2005.


 Please advise if you still need the information although this part is

 pruned.


 Best Regards,

 Rose Sandoval

 Quality Systems & Customer Support

 Cypress Manufacturing Limited, Philippines






Can somebody tell me what they're trying to say?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
__________________________________________________________________
This message may contain information that is privileged and confidential to
LaBarge, Inc.  It is for use only by the individual or entity named above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone.  In such event, you should destroy the message and
kindly notify the sender by reply e-mail.

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