Hi guys,

I have one problem here and I need your expertise to help me. Ok recently
our fine pitch IC (20mils) has shorted/bridged after printing as we change
from leaded to lead free solder paste. Most of the bridging at the fine
pitch occurred in parallel to squeegee moving direction. Any suggestion or
input is greatly appreciated.

Note:
Squeegee type: metal
Stencil thickness: laser cut (5mils)
Solder paste: Kester EM907
Printer: DEK288
Separation speed: 2mm/sec
Printing speed: 25mm/sec
Squeegee pressure: 8Kg


Best Regards,
Azman

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