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July 2005

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Subject:
From:
"Kane, Christopher" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Christopher
Date:
Mon, 11 Jul 2005 11:47:07 -0400
Content-Type:
text/plain
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text/plain (54 lines)
Robert,
Yes. It is J-STD-006 and IPC-2221 table 4-3 page 21.

Christopher J Kane
Mechanical Engineering
Lockheed Martin Systems Integration
1801 State Route 17c Owego, NY 13827-3994
Telephone (607) 751-6213


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Robert Coburn
Sent: Monday, July 11, 2005 11:34 AM
To: [log in to unmask]
Subject: [TN] Spec limits / Solder paste height


Hi T'Netters;
Is there a standard for spec limits for Solder Paste height and how is
it
determined?
Just want to make sure that our current limits are in line.
Any assistance is greatly appreciated.
TIA
Regards,
Rob

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