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July 2005

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From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:
Wed, 6 Jul 2005 07:28:54 -0400
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Ingemar,

We used the 4450 for die ranging from something like 8 mils up to ~600 mils.  

There are various shapes and sizes of nozzles that fit into the hot gas heater to concentrate/localize the flow of heated nitrogen to the work.

Low[er] modulus adhesives for the large devices helped a great deal.

Unfortunately, I don't have any good pictures to share.  I don't have one of these gizmos here.  In current position, if it is not correct the first time, it is scrap.

One could also look at SEC's 4020 eutectic die bonder set-up to get some thoughts and ideas.

Get SEC to send you some electronic brouchures and such to better illustrate their equipment.  I have some old ones but they are of mediocre quality.  I can dig up a contact name out at SEC there if you wish.

Hot plate and sharp chisel .......  and a microscope, of course.  We can have you up in no time!!!

Have a great day

Steve Creswick - Gentex Corp



-----Original Message-----
From: Ingemar Hernefjord (KC/EMW)
[mailto:[log in to unmask]]
Sent: Monday, July 04, 2005 2:24 AM
To: Creswick, Steven; TechNet E-Mail Forum
Subject: RE: [TN] Semi chip removal tool wanted


Steve,

what is the range of chips that can be removed? As you know, smallest chips are just about 25 mils and largest half an inch wide. Do you have a picture that shows details? The semicorp photo is unclear. The 450 may be something. We have some more or less monstrous heat gas removal machines, but they are for  removing SMT components, don't suitable for MCMs.

Did you see Pink Floyd in action again? Outstanding. Those old guys leave most youngster far behind...

Ingemar

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