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July 2005

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Subject:
From:
Barry Gallegos <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Barry Gallegos <[log in to unmask]>
Date:
Thu, 28 Jul 2005 09:07:59 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (281 lines)
I just wanted to say Thank you once again to a 
team of absolutely selfless individuals willing
to share their knowledge base. 

Thank you 
Barry Gallegos




-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Douglas O. Pauls
Sent: Thursday, July 28, 2005 9:07 AM
To: [log in to unmask]
Subject: [TN] Fw: [TN] RoHs board surface recommendations.


Forgot to include the rest of you.

Doug Pauls

----- Forwarded by Douglas O Pauls/CedarRapids/RockwellCollins on
07/28/2005 10:06 AM -----

             Douglas O
             Pauls/CedarRapids
             /RockwellCollins                                           To
                                       "Wenger, George M."
             07/28/2005 10:05          <[log in to unmask]>
             AM                                                         cc

                                                                   Subject
                                       RE: [TN] RoHs board surface
                                       recommendations.(Document link:
                                       Douglas O Pauls)









Well, actually, it was before my usual morning input of Dew, so I perhaps
came off as a little more alarmist than usual. Sorry Phil.

It would be correct to say that all other factors being equal, an ENIG
board will be more robust against the storage environment and conditions
and have fewer shelf life and solderability issues, compared to immersion
silver or immersion tin.

I participated in a panel discussion at the Fall IPC meeting last year, and
I think the IPC has the composite powerpoint used from that, on board
storage problems and nightmares.  A rousing good sharing of horror stories.
Kinda like the IPC version of sitting around the campfire swapping ghost
stories.

The point I would like to make is that with more of us going to alternative
finishes, we need to be aware of how packaging materials, shipment methods,
and board storage environments impact the quality of the board before it
ever hits the assembly process.  How we handle these boards coming out of
storage also makes a difference.  Example, people often specify cotton
gloves for handling boards.  Nice white cotton gloves.  How do they get
white.  Chloride bleach.  What's in chloride bleach?  Chlorine.  What's the
last material you want contacting silver?  Chlorine.

We now return you to your regularly scheduled conversations......

Doug Pauls
(on my second Dew)




             "Wenger, George
             M."
             <George.Wenger@an                                          To
             drew.com>                 "TechNet E-Mail Forum"
                                       <[log in to unmask]>,
             07/28/2005 08:41          <[log in to unmask]>
             AM                                                         cc

                                                                   Subject
                                       RE: [TN] RoHs board surface
                                       recommendations.










Doug,

Nicely put.  You must have started on the Mountain Dew early today.

Regards,

George

George M. Wenger, Reliability Engineer
Andrew Corporation
40 Technology Drive
Warren, NJ 07059
(908) 546-4531 or  (732) 309-8964 (Cell)


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Thursday, July 28, 2005 9:12 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.


Whoa.  Back up the trolley.  All boards have handling and storage
issues. Maybe not from a solderability perspective but certainly from a
cleanliness perspective.

Never make all encompassing statements, which, come to think of it, is
an all encompassing statement........

Doug Pauls




             Phil Nutting
             <PNutting@KAISERS
             YSTEMS.COM>
To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>
cc


Subject
             07/28/2005 08:03          Re: [TN] RoHs board surface
             AM                        recommendations.


             Please respond to
              TechNet E-Mail
                   Forum
             <[log in to unmask]>
             ; Please respond
                    to
               Phil Nutting
             <PNutting@KAISERS
                YSTEMS.COM>






And ENIG has no handling and storage issues like Immersion Silver and
Immersion Tin.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Thursday, July 28, 2005 8:49 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.

If you are talking about PWB metallization, I would recommend ENIG. It
is compatible with both Tin/Lead and Lead-free.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
Sent: Thursday, July 28, 2005 8:27 AM
To: [log in to unmask]
Subject: [TN] RoHs board surface recommendations.

Good Day TecNetters.

Does anybody out there have Board surface recommendations for a RoHs
process ?

A matrix would be preferred. I don't seem to recall seeing any such type
of document or discussions on TechNet so any help would be greatly
appreciated.

Barry
Western Electronics.




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