Ofer,
Thanks for the report.
I'll look through it .
dave.
Ofer Cohen wrote:
>Dave,
>
>Sure: one I have (thanks to the newly installed xxx [no advertisement
>here!] search engine I could even find it), and one I lost.
>
>The one I have states:
>
>1. Section 4.1.2 - both galvanic and immersion Au show
>the biggest deformations, and also the biggest risk for cracks due to
>the hard layers
>
>2. Section 5 - that the retention force of the gold
>coating is lower then the ImSn
>
>
>
>CC&CE EMEA Development Engineering REPORT
>
>Lead-free manufacturing Effects on press-fit connections
>
>Authors: Eric Verhelst, [log in to unmask]; Tom Ocket,
>[log in to unmask]
>
>Tyco Electronics Belgium EC,
>
>Siemenslaan 14,
>
>8020 Oostkamp,
>
>Belgium
>
>Issued: July 2002
>
>
>
>The one I lost contains the results of another comparison made by Tyco
>between finishes, and is using even less forgiving words.
>
>
>
>Regards
>
>Ofer Cohen
>
>Manager
>
>Quality Assurance, Reliability and Production Technologies
>
>Seabridge Ltd. - A Siemens Company
>
>Siemens COM FN A SB TQM
>
>
>
> _____
>
>From: Dave Seymour [mailto:[log in to unmask]]
>Sent: Thursday, July 28, 2005 3:48 PM
>To: TechNet E-Mail Forum; Ofer Cohen
>Subject: Re: [TN] RoHs board surface recommendations.
>
>
>
>Ofer,
>
>The statement "that bans the ENIG from use when Press-Fit connectors are
>installed."
>is interesting.
>
>Do you have articles or data that show support this statement?
>
>Thanks,.
>Dave
>
>
>
>
>Ofer Cohen wrote:
>
>Phil,
>Rubber glove and immersion Silver?
>
>Apropos the encompassing statement - not to mention the good ol' black
>pads (that still show their face here and there, in spite of the better
>chemistry), there is the Ni brittleness, that bans the ENIG from use
>when Press-Fit connectors are installed.
>
>Regards
>Ofer Cohen
>Manager
>Quality Assurance, Reliability and Production Technologies
>Seabridge Ltd. - A Siemens Company
>Siemens COM FN A SB TQM
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
> Sent: Thursday, July 28, 2005 3:24 PM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> Doug,
>
> Sometimes my all encompassing statements do not give enough of
>the
>
>
>nitty
>
>
> gritty details. Too often when I start with the details I can
>see my
> listener's eyes roll into the back of their head.
>
> OK. Would it help if I said it has fewer issues? From our
>research
> with Immersion Silver we need to keep the boards sealed until
>use them
> and then handle with rubber gloves. Immersion Tin is a little
>more
> forgiving on storage and can be handled with cotton gloves.
>ENIG
>
>
>seems
>
>
> to be less affected by storage and handling.
>
> If I'm WAY off base, I apologize and retreat in disarray.
>
> Phil
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O.
>Pauls
> Sent: Thursday, July 28, 2005 9:12 AM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> Whoa. Back up the trolley. All boards have handling and
>storage
> issues.
> Maybe not from a solderability perspective but certainly from a
> cleanliness
> perspective.
>
> Never make all encompassing statements, which, come to think of
>it, is
> an
> all encompassing statement........
>
> Doug Pauls
>
>
>
>
> Phil Nutting
> <PNutting@KAISERS
><mailto:[log in to unmask]>
> YSTEMS.COM> <mailto:[log in to unmask]>
> To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]> <mailto:[log in to unmask]>
> cc
>
>
> Subject
> 07/28/2005 08:03 Re: [TN] RoHs board
>surface
> AM recommendations.
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]> <mailto:[log in to unmask]>
> ; Please respond
> to
> Phil Nutting
> <PNutting@KAISERS
><mailto:[log in to unmask]>
> YSTEMS.COM> <mailto:[log in to unmask]>
>
>
>
>
>
>
> And ENIG has no handling and storage issues like Immersion
>Silver and
> Immersion Tin.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
> Sent: Thursday, July 28, 2005 8:49 AM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> If you are talking about PWB metallization, I would recommend
>ENIG. It
> is
> compatible with both Tin/Lead and Lead-free.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry
>Gallegos
> Sent: Thursday, July 28, 2005 8:27 AM
> To: [log in to unmask]
> Subject: [TN] RoHs board surface recommendations.
>
> Good Day TecNetters.
>
> Does anybody out there have Board surface recommendations for a
>RoHs
> process
> ?
>
> A matrix would be preferred. I don't seem to recall seeing any
>such
>
>
>type
>
>
> of
> document
> or discussions on TechNet so any help would be greatly
>appreciated.
>
> Barry
> Western Electronics.
>
>
>
>
> ---------------------------------------------------
>
>
>
>
>
>
>
>
--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560
Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297
[log in to unmask]
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