Phil,
Rubber glove and immersion Silver?
Apropos the encompassing statement - not to mention the good ol' black
pads (that still show their face here and there, in spite of the better
chemistry), there is the Ni brittleness, that bans the ENIG from use
when Press-Fit connectors are installed.
Regards
Ofer Cohen
Manager
Quality Assurance, Reliability and Production Technologies
Seabridge Ltd. - A Siemens Company
Siemens COM FN A SB TQM
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
> Sent: Thursday, July 28, 2005 3:24 PM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> Doug,
>
> Sometimes my all encompassing statements do not give enough of the
nitty
> gritty details. Too often when I start with the details I can see my
> listener's eyes roll into the back of their head.
>
> OK. Would it help if I said it has fewer issues? From our research
> with Immersion Silver we need to keep the boards sealed until use them
> and then handle with rubber gloves. Immersion Tin is a little more
> forgiving on storage and can be handled with cotton gloves. ENIG
seems
> to be less affected by storage and handling.
>
> If I'm WAY off base, I apologize and retreat in disarray.
>
> Phil
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
> Sent: Thursday, July 28, 2005 9:12 AM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> Whoa. Back up the trolley. All boards have handling and storage
> issues.
> Maybe not from a solderability perspective but certainly from a
> cleanliness
> perspective.
>
> Never make all encompassing statements, which, come to think of it, is
> an
> all encompassing statement........
>
> Doug Pauls
>
>
>
>
> Phil Nutting
> <PNutting@KAISERS
> YSTEMS.COM>
> To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]>
> cc
>
>
> Subject
> 07/28/2005 08:03 Re: [TN] RoHs board surface
> AM recommendations.
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> Phil Nutting
> <PNutting@KAISERS
> YSTEMS.COM>
>
>
>
>
>
>
> And ENIG has no handling and storage issues like Immersion Silver and
> Immersion Tin.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
> Sent: Thursday, July 28, 2005 8:49 AM
> To: [log in to unmask]
> Subject: Re: [TN] RoHs board surface recommendations.
>
> If you are talking about PWB metallization, I would recommend ENIG. It
> is
> compatible with both Tin/Lead and Lead-free.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
> Sent: Thursday, July 28, 2005 8:27 AM
> To: [log in to unmask]
> Subject: [TN] RoHs board surface recommendations.
>
> Good Day TecNetters.
>
> Does anybody out there have Board surface recommendations for a RoHs
> process
> ?
>
> A matrix would be preferred. I don't seem to recall seeing any such
type
> of
> document
> or discussions on TechNet so any help would be greatly appreciated.
>
> Barry
> Western Electronics.
>
>
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at
[log in to unmask]
> or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100
> ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at
[log in to unmask]
> or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100
> ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at
[log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
