Doug,
Sometimes my all encompassing statements do not give enough of the nitty
gritty details. Too often when I start with the details I can see my
listener's eyes roll into the back of their head.
OK. Would it help if I said it has fewer issues? From our research
with Immersion Silver we need to keep the boards sealed until use them
and then handle with rubber gloves. Immersion Tin is a little more
forgiving on storage and can be handled with cotton gloves. ENIG seems
to be less affected by storage and handling.
If I'm WAY off base, I apologize and retreat in disarray.
Phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Thursday, July 28, 2005 9:12 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
Whoa. Back up the trolley. All boards have handling and storage
issues.
Maybe not from a solderability perspective but certainly from a
cleanliness
perspective.
Never make all encompassing statements, which, come to think of it, is
an
all encompassing statement........
Doug Pauls
Phil Nutting
<PNutting@KAISERS
YSTEMS.COM>
To
Sent by: TechNet [log in to unmask]
<[log in to unmask]>
cc
Subject
07/28/2005 08:03 Re: [TN] RoHs board surface
AM recommendations.
Please respond to
TechNet E-Mail
Forum
<[log in to unmask]>
; Please respond
to
Phil Nutting
<PNutting@KAISERS
YSTEMS.COM>
And ENIG has no handling and storage issues like Immersion Silver and
Immersion Tin.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Edwin Louis
Sent: Thursday, July 28, 2005 8:49 AM
To: [log in to unmask]
Subject: Re: [TN] RoHs board surface recommendations.
If you are talking about PWB metallization, I would recommend ENIG. It
is
compatible with both Tin/Lead and Lead-free.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Barry Gallegos
Sent: Thursday, July 28, 2005 8:27 AM
To: [log in to unmask]
Subject: [TN] RoHs board surface recommendations.
Good Day TecNetters.
Does anybody out there have Board surface recommendations for a RoHs
process
?
A matrix would be preferred. I don't seem to recall seeing any such type
of
document
or discussions on TechNet so any help would be greatly appreciated.
Barry
Western Electronics.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
