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July 2005

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 26 Jul 2005 17:27:19 EDT
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Hi Ivan,
Maybe i misread your initial e-mail, but i read from 0,15 to 0,4%.
Regardless, that percentage will most likely not remain at either of these numbers,
depending   of what gets dragged in and out of your bath. Further, other metals
will also increase in the bath because of the much more aggressive nature of the
high Sn-content LF-solders. you may want to take a look at Dave Hillmann's
paper at ECTC this year regarding SnAg IMCs.

Werner

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