Good morning Werner,
        one thing for sure is that I'm not an expert at all on this topic, but
I would like to share with you a couple of thoughts that can eventually
help me understand better metallurgy.

Personally I would think that an increase in Ag content from 0,1% to
0,14% would not be significant.  It recalls me about the alloy
62Sn-36Pb-2Ag.
If Ag works well for that alloy up to 2%, why should be a problem
having 0,14%.

Being in EU, I'll be facing lead free alloys, components and pcb LF
plated, shortly.   Ag is one of the prominent element in that scenario.
I understand that Ag embrittles SJ,  just as Au does, but I felt that
one might have gone for a higher quantity of Ag in the joint rather
that a merely 0,14%, before getting worried for joint embrittlement.

At this point I'm a bit puzzled: immersion Ag, Ag alloys, ....
Ag is so present that your words have rang a couple of warning bells in
my mind.

Please advice
Ivan


Il giorno 25/lug/05, alle 21:46, Werner Engelmaier ha scritto:

> Hi arnaud,
> It sure will impact reliability.
> Ag-embrittlement is actually worse than Au-embrittlement; you just do
> not
> hear about it, since nobody in his rioght mind electroplates Ag onto
> soldering
> surfaces as was done quite a bit with Au. In 1982 TI actually did this
> and
> components literally fell off the PCBs at IBM-Austin--this was the
> reson or the
> creation of the IEEE Compliant Lead Task Force.
>
> Regards,
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
>
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