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July 2005

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Subject:
From:
Arnaud GRIVON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Arnaud GRIVON <[log in to unmask]>
Date:
Mon, 25 Jul 2005 09:46:42 +0200
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TechNetters,

What could be the impact of a silver contamination in a tin-lead wave
solder bath?
The silver content of the SnPb wave solder bath jumped to 0.14% (vs 0.1%
allowed) and the corresponding joints look grainy.
Can this have an impact on reliability? I seem to remind of a MIL spec
detailing the effects of different metallic contaminants but am unable
to find it.
Thanks in advance for your insights.

Best regards,

A. Grivon

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