Or, it can apply to theiving pads which are extra pads in
a SOIC footprint for a part that is going to be wave soldered.
The extra pads are placed besides the last pads of the footprint
that will be going over the wave. Supposedly, this will prevent
solder bridges.
I haven't seen them used enough to tell you whether or not that
works...
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
Franklin Asbell <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/22/2005 02:13 PM
Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Franklin Asbell <[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: Re: [TN] layman's definition of theiving
Thieving is nothing more than added copper (usually in a specific pattern,
crosshatch, dots, etc) in non-functional areas of the board, applied for the
purpose of providing a more uniform surface area during electroplating.
Common uses are where there are long isolated traces leaving areas of more
dense copper features.
Was that laymen?
Franklin
----- Original Message -----
From: "Phil Nutting" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, July 22, 2005 1:34 PM
Subject: [TN] layman's definition of theiving
Ok, I have to admit my lack of knowledge.
Can someone point me to a the Cliff's Notes version of Theiving on PC
boards?
Thanks in advance.
Phil
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