Paul,
Thicker board? Nope. Re-lay out a board? For the latter I would have
to talk to a designer for sure, but I can tell you that by using
Thermoire we have found some boards and some parts with warpage - some
insignificant, some not. "It all depends". Phrase either copyrighted or
trademarked by Doug Pauls. :)
Regards,
Bev
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Black, Paul
Sent: July 21, 2005 5:35 PM
To: [log in to unmask]
Subject: [TN] BGA's and Lead free
Hi Everyone,
We are starting to redesign a product for RoHS compliance and one of our
engineers has a concern. Due to the higher oven temps, he is afraid that
excess warpage may occur to the board and large components, particularly
the BGA's, and the resulting stress will lead to failures. He is
considering increasing the thickness of the board, which would be an
expensive proposition. Our largest BGA is a 19 x 19, 357 pin 1.27mm
pitch part on a 7" x 9" .062" board. I know that a number of you have
been working with lead free for a while. Have you had a need to increase
the thickness of the board?
Thank you,
Paul Black
Manufacturing Engineer
Kronos
E-mail: [log in to unmask]
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