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| From: | |
| Reply To: | |
| Date: | Thu, 21 Jul 2005 12:34:25 -0500 |
| Content-Type: | text/plain |
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Hi Cheryl!
IPC-600G, section 2.9.3.3 says that if a soldermask dam (web) was supposed
to be
there between a BGA and a via, it should be there, otherwise it's
nonconforming.
But it doesn't say how big the dam should be...
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
|---------+--------------------------------->
| | Cheryl Johnson |
| | <[log in to unmask]
| | ELSTOR.COM> |
| | Sent by: TechNet |
| | <[log in to unmask]> |
| | |
| | |
| | 07/21/2005 11:01 AM |
| | Please respond to |
| | TechNet E-Mail Forum |
| | <[log in to unmask]>; |
| | Please respond to |
| | Cheryl Johnson |
| | <[log in to unmask]
| | ELSTOR.COM> |
| | |
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>--------------------------------------------------------------------------------------------------------------|
| |
| To: [log in to unmask]@SMTP@Exchange |
| cc: (bcc: Stephen R Gregory/LABARGE) |
| Subject: [TN] Soldermask inspection |
>--------------------------------------------------------------------------------------------------------------|
Do you know if any spec exists defining minimum soldermask webs
(particularly between vias and bga pads)?
Any inspection criteria?
Your help is appreciated.
Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
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