Peer,
Internal short, hmm? Start with high magnification x-ray. If you were
talking about opens, I would also suggest acoustic microscopy. This is
really a question for the EDFAS bulletin board - equivalent of TechNet
(EDFAS is an arm of ASM - which used to be called American Society of
Metals, I think, but the meaning has disappeared, just like it has for
IBM and IPC).
If you are going to send it to the supplier I would suggest:
1) Sending the whole board, if you have no intellectual property
concerns
2) Cutting the part out of the board still attached to the laminate it
is soldered to
3) Only desolder the part if you know it is dry because you have dried
it as per J-033 AND are sure that the heat of desoldering will not mess
with what you want the supplier to look at.
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Lee
Sent: July 19, 2005 1:58 AM
To: [log in to unmask]
Subject: [TN] Component Failure analysis
Technet,
What are possible failure analysis (destructive or non-destructive and
what
are the pro/cons) I could conduct on the component level (of an IC) to
determine failure mode/root cause?
We are measuring internal shorts between leads on a SOIC after
soldering.
Troubleshooting has pointed towards that failure is component (not
soldering
process) related. I am looking for an independent lab that can offer
such
service.
Rgds,
Peter
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