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July 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Tue, 19 Jul 2005 07:39:27 -0400
Content-Type:
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Pull the device off and test independent of the PCB?

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: Peter Lee [mailto:[log in to unmask]] 
Sent: Tuesday, July 19, 2005 1:58 AM
To: [log in to unmask]
Subject: [TN] Component Failure analysis

Technet,

What are possible failure analysis (destructive or non-destructive and
what
are the pro/cons) I could conduct on the component level (of an IC) to
determine failure mode/root cause?

We are measuring internal shorts between leads on a SOIC after
soldering.
Troubleshooting has pointed towards that failure is component (not
soldering
process) related. I am looking for an independent lab that can offer
such
service.


Rgds,
Peter

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