Judy, It is a matte finish, thermal cure solder mask.
Scott B. Westheimer
Colonial Circuits, Inc.
----- Original Message -----
From: "Judy Brown" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, July 18, 2005 5:01 PM
Subject: Re: [TN] SR-1000
Hi,
Does anyone out there know for sure what finish the soldermask
SR-1000 comes in? Is it strictly matte or is it glossy? Is it LPI or dry
film? I always thought that it was LPI semi-gloss. Please comment.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Gregory
Sent: Monday, July 18, 2005 11:07 AM
To: [log in to unmask]
Subject: [TN] BGA voids
Good Day Technetters!
I have a question about BGA voids. We are bidding on some
work and it looks like they have taken statements that are in the
IPC-7095,
and placed them as notes on their drawing.
One of the notes has to do with a limit on the percentage of balls on a
BGA
device that are allowed to have voids. For example; "Less than 5% of the
balls can have voids, and the percentage of the void area must meet
class
3 requirements."
I can understand the void area being critical, but the percentage of the
number of balls that are allowed to exhibit them?
The reason that I'm asking, is that I was told last week by a
application
engineer from a x-ray machine company (who shall remain nameless),
that seeing voids is normal. Just as long as they aren't too big, or
being
concentrated at either the pad/ball interface, or the ball/device
interface.
He said you should worry if you don't see any voids on BGA's with
eutectic
balls.
Just curious as to what you all think about this?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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