Hi Steve! The IPC-7095A document is a guidelines document and does not
contain specific acceptance/rejection requirements. Paragraph 7.5.1.7 lists
the JSTD-001/IPC-610 specifications as containing the acceptance/rejection
criteria. Those drawing notes should only be referencing the
JSTD-001/IPC-610 specifications.

Dave Hillman
Rockwell Collins
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             Stephen Gregory
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             LABARGE.COM>                                               To
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             07/18/2005 01:07          [TN] BGA voids
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Good Day Technetters!

I have a question about BGA voids. We are bidding on some
work and it looks like they have taken statements that are in the IPC-7095,
and placed them as notes on their drawing.

One of the notes has to do with a limit on the percentage of balls on a BGA
device that are allowed to have voids. For example; "Less than 5% of the
balls can have voids, and the percentage of the void area must meet class
3 requirements."

I can understand the void area being critical, but the percentage of the
number of balls that are allowed to exhibit them?

The reason that I'm asking, is that I was told last week by a application
engineer from a x-ray machine company (who shall remain nameless),
that seeing voids is normal. Just as long as they aren't too big, or being
concentrated at either the pad/ball interface, or the ball/device
interface.
He said you should worry if you don't see any voids on BGA's with eutectic
balls.

Just curious as to what you all think about this?

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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