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July 2005

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Subject:
From:
Ofer Cohen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ofer Cohen <[log in to unmask]>
Date:
Fri, 15 Jul 2005 07:20:51 +0200
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Does the card pass mechanical steps after the assembly - press fit, separation from a panel, etc.? Are the capas close to the card's edge?

Ofer Cohen
Seabridge
A Siemens company

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Karen 
> Walters Ebner
> Sent: Thursday, July 14, 2005 20:31
> To: [log in to unmask]
> Subject: [TN] Cracked Passives
> 
> Would anyone list for me in most probable order the causes 
> for cracked capacitors.  Has anyone had issues with cracked 
> caps with SnAg Solder paste????
> 
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