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July 2005

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Subject:
From:
Mary Jane Chism <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mary Jane Chism <[log in to unmask]>
Date:
Thu, 14 Jul 2005 15:32:09 -0500
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Kat,

The component lead is on a connector and the lead is a double-sided
lead.  The process is "selective solder" and only one unit of the three
that is passing through the machine is experiencing this problem.  It
was evaluated that it is probably the fluxer causing this occurrence.
The selective solder process is in the process of very evaluated more
thoroughly before the conclusion is made.  Because of the size of the
lead, the lead is touching the barrel, but the solder is not flowing
completely around the lead and barrel in the barrel.

Our evaluation was that we did not want to accept the solder joints that
are experiencing the void in the barrel, even though it is 270 degrees,
but were looking for something in print to express this.  


Thanks,

Mary Jane 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kathy Kuhlow
Sent: Thursday, July 14, 2005 2:50 PM
To: [log in to unmask]
Subject: Re: [TN] FW: Vertical Fill Through Hole

Technically, if you are maintaining the solder joint minimums for all of
the criteria it should be acceptable but most people will not want to
accept that as a good joint. Most customers I have dealt with across all
industries understand that there are minimums but do not want to take a
minimum solder joint especially if there is a large void in the solder
joint. Considering this then what are you left with? 

Are you dealing with oversized holes and small lead diameters?  Do you
notice a difference if you slow down the wave speed a bit to allow for
more of the solder joint to form?  Are you seeing the void area on leads
or retaining pins?  Can you share a bit more info?  

Kat

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