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July 2005

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Subject:
From:
"Langston, Robert L" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Langston, Robert L
Date:
Thu, 14 Jul 2005 15:23:24 -0400
Content-Type:
text/plain
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text/plain (77 lines)
Check with the vendor concerning sensitivity to thermal shock.
It has been a severe problem in the industry for many years.
Most recommend a preheat to within 50 degrees of reflow temp.prior to
reflow.
This can ruin your day if you are hand soldering.

-----Original Message-----
From: Dale Ritzen [mailto:[log in to unmask]] Sent: Thursday, July 14, 2005
3:01 PM
To: [log in to unmask]
Subject: Re: [TN] Cracked Passives

Karen,
Stress is a major factor. We had a devil of a time on one of our customer's
boards with chip cap placement too close to the depanelization cut, and also
with the positioning of the part, i.e. parallel vs. perpendicular to the
edge. One of the chip cap manufacturers (Venkel, SMEC, ???) had a very good
white paper on this exact situation a while back, with pictures of how the
stress affected the devices in different positions. I no longer have a soft
copy of that paper or I'd forward it to you. Perhaps someone else has one
(or a similar paper) and can send it your way.

Good luck!
Dale Ritzen, CQA
Quality Manager
Austin Manufacturing Services


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Karen Walters Ebner
Sent: Thursday, July 14, 2005 1:31 PM
To: [log in to unmask]
Subject: [TN] Cracked Passives


Would anyone list for me in most probable order the causes for cracked
capacitors.  Has anyone had issues with cracked caps with SnAg Solder
paste????

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