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Date: | Fri, 1 Jul 2005 10:11:57 -0500 |
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We just had such a case with 122 boards. The problem was the damage was
severe enough that the 3.3 volt plane 6 mils down was exposed. This
exposure of the 3.3 volt plane to the ground tie on the pin passed
electrical test but I guarantee that once the board was soldered we would
have a dead short from 3.3 to ground. We rejected the 122 damaged boards.
-Al
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Thursday, June 30, 2005 9:25 AM
To: [log in to unmask]
Subject: [TN] Via holes damaged
Group,
I have a question on via holes damaged by test probes. We have a
situation where some of the annular ring of the vias used for test
points are being damaged. I have looked in the IPC-A-610 Rev. D and
also IPC-A-600 Rev. G, but am not finding what I need or am not looking
in the right place. If anyone knows of the requirements of what is
acceptable or a defect for this type of condition, please let me know.
Thanks.
Mary Jane
Mary Jane Chism
Technical Trainer/ Learning Center
Kimball Electronics Group
email: [log in to unmask] <mailto:[log in to unmask]>
Phone: 812-634-4462
Fax: 812-634-4501
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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