Huh! What are the odds that two guys with such similar names, working for
the same company, would give such similar answers? It's like Lou Gehrig
getting Lou Gehrig's disease....
-Chris
Stephen R Gregory
<[log in to unmask] To: [log in to unmask]
OM> cc:
Sent by: TechNet Subject: Re: [TN] Soldermask inspection
<[log in to unmask]>
07/21/2005 01:34 PM
Please respond to TechNet
E-Mail Forum; Please
respond to Stephen R
Gregory
Hi Cheryl!
IPC-600G, section 2.9.3.3 says that if a
soldermask dam (web) was supposed to be
there between a BGA and a via, it should be
there, otherwise it's nonconforming.
But it doesn't say how big the dam should
be...
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
Cheryl Johnson <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
07/21/2005 11:01 AM
Please respond to TechNet E-Mail Forum
<[log in to unmask]>; Please respond to Cheryl Johnson
<[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: [TN] Soldermask inspection
Do you know if any spec exists defining
minimum soldermask webs
(particularly between vias and bga pads)?
Any inspection criteria?
Your help is appreciated.
Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
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