TECHNET Archives

July 2005

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Coupon Thermal Stress
From:
Rich Olsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rich Olsen <[log in to unmask]>
Date:
Fri, 1 Jul 2005 14:16:01 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Hi,

        During multiple thermal stress testing of coupons is there an established
relaxation time between each float on the solder? The coupons are
crossection after the floats.

thanks,
Rich

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2