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Sender:	TechNet <[log in to unmask]>
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Date:	Fri, 1 Jul 2005 09:36:14 -0700
Reply-To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:	Wave hole fill silver immersion vs osp with sac solder
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From:	Cliff Knudson <[log in to unmask]>
Parts/Attachments:	text/plain (17 lines)

I was wondering if anyone would have any comparison data on wetting or
hole fill for wave process using SAC solder comparing osp and immersion
silver surface finishes. Only differences would be surface finishes.

Thanks
Cliff

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