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Mon, 11 Jul 2005 16:27:01 -0500 |
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As a reminder, please plan on participating in the D-54 Embedded Devices
Test Methods Subcommittee teleconference this Thursday, July 14 at 3:00
pm Central Daylight time.
The primary agenda item is one final review of the latest Draft 2 of
proposed Test Method 2.5.7.2 (See Word document attachment). It is
intended that this test method will be wrapped up and published in the
form that will result from this teleconference. Accordingly, please
plan to participate with your comments - It is your last chance before
this method is released.
The contact information for this teleconference is, as follows:
D-54 EMBEDDED DEVICES SUBCOMMITTEE TELECONFERENCE
Date: THURSDAY, JULY 14, 2005
Time: 3:00 - 4:00 PM CDT
Call-In: 1-620-584-8200; PIN: 89542#
Both Robert Croswell and Jan Obrzut, your D-54 Subcommittee Co-Chairs,
are planning on your participation in this last review of the TM
2.5.7.2, "Dielectric Withstanding Voltage - Thin Embedded Capacitor
Layers for Printed Wiring Boards".
Thank you for your attention to this teleconference.
Tom Newton
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