1)      DuPont Electronic Technologies and Sanmina-SCI Sign Licensing 
Agreement for DuPont? Interra? Embedded Passive Materials Use in Buried 
Capacitance® Technology
RESEARCH TRIANGLE PARK, NC., July 22, 2005 - DuPont Electronic 
Technologies today announced an agreement with Sanmina-SCI to become a 
licensee of Sanmina-SCI?s patented Buried Capacitance® technology. DuPont? 
Interra? HK polyimide laminates can now be used in the practice of Buried 
Capacitance® technology, available to Sanmina-SCI?s existing family of 
licensed printed circuit board (PCB) manufacturers.  The combination of 
DuPont? Interra? planar capacitor laminates and the Sanmina-SCI Buried 
Capacitance® technology enables smaller, more reliable, high-performing 
electronics.
?We are excited that DuPont Electronic Technologies has licensed our 
Buried Capacitance® technology,? said George Dudnikov, senior vice 
president and chief technology officer for Sanmina-SCI?s PCB and Backplane 
Divisions.  ?Buried Capacitance® technology is an enabler for 
high-technology printed circuit boards in the telecommunications, high-end 
computing and military markets.  The benefits of using Buried Capacitance® 
technology can be seen in a variety of areas, particularly in the 
reduction of high-frequency electromagnetic interface noise and in a 
quieter power distribution system.  Sanmina-SCI continues to develop and 
invest in leading-edge technologies and this agreement with DuPont 
Electronic Technologies is one more example of our commitment to the 
industry.?
?We look at this agreement as a winning combination for our customers,? 
said Robert J. O?Connor, global business manager, Embedded Passives, 
DuPont Electronic Technologies. ?DuPont? Interra? HK planar capacitor 
laminates are easy to use and extremely reliable, which is why they are 
being rapidly integrated into many large scale, high-end application 
designs. As we continue to put science to work in developing increasingly 
thinner and higher capacitance density materials to expand the Interra? 
embedded passive materials product line, we are pleased to work with 
technology partners like Sanmina-SCI to contribute to our customers? 
success.?
As designers look to reduce size, improve performance and build more 
cost-effective electronic devices, they increasingly rely on embedded 
passive technology, and DuPont Electronic Technologies is creating the 
broadest portfolio in the world for embedded passive materials under the 
DuPont? Interra? brand. By combining its strengths in laminates, polymer 
thick films and ceramic paste materials, DuPont has developed the Interra? 
embedded passive materials family to include embedded planar capacitor 
laminates, screen printable polyimide thick film paste products, and 
ceramic-based screen printable thick film pastes in the broadest range of 
resistance and capacitance available.
The benefits of using Buried Capacitance® technology can be seen in a 
variety of areas, particularly in the reduction of high-frequency 
electromagnetic interface (EMI) noise and in a quieter power distribution 
system. Even more, Buried Capacitance® potentially reduces many bypass 
capacitors from the surface of a PCB, which equates to assembly cost 
reductions along with increasing the available surface area for increased 
circuit routing density. In support of this, the license offers access to 
a variety of Buried Capacitance® materials in the 0-4 mil dielectric 
thickness range, which now includes DuPont? Interra? HK04 and HK 11 
polyimide laminates.
DuPont Electronic Technologies is a leading supplier of electronic 
materials, including materials for the fabrication and packaging of 
semiconductors, materials for rigid and flexible circuits, and materials 
for advanced displays. 
For more information about DuPont? Interra? embedded passive materials, 
visit www.dupont.com/fcm/interra.
DuPont is a science company. Founded in 1802, DuPont puts science to work 
by creating sustainable solutions essential to a better, safer, healthier 
life for people everywhere. Operating in more than 70 countries, DuPont 
offers a wide range of innovative products and services for markets 
including agriculture, nutrition, electronics, communications, safety and 
protection, home and construction, transportation and apparel.
The DuPont Oval, DuPont, The miracles of science, and Interra? are 
registered trademarks or trademarks of DuPont or its affiliates. Buried 
Capacitance® is a trademark of Sanmina-SCI.