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June 2005

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From:
"COOKE, ROBERT W. (JSC-NX) (WGI)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, COOKE, ROBERT W. (JSC-NX) (WGI)
Date:
Wed, 1 Jun 2005 08:03:39 -0500
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text/plain (65 lines)
Mary Jane,

ANSI/IPC-SM-817 is still used as a reference for the adhesives used to bond
surface mount components to the board during the assembly and soldering
operation.

J-STD-001CS covers the basic requirements for adhesive bonding of components
for protection against vibration and shock.  This is a Space Applications
document, so the bonding requirements may be more (or less) rigorous than
your application requires.  Keep in mind that adhesive bonding (staking) is
application specific - what worked in the last design might make things
worse in the next design. J-STD-001CS is available as a free download from
the IPC website.

IPC-CC-830B has some useful information about the various materials that can
be used for adhesive bonding, even though it is primarily for conformal
coatings.

IPC-2221A has some additional info.

Regards,

Bob


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mary Jane Chism
Sent: Tuesday, May 31, 2005 3:40 PM
To: [log in to unmask]
Subject: [TN] Staking Adhesive

Other than the IPC-A-610 document, is there an IPC document that gives
specifications on staking adhesive?

Thanks.

Mary Jane Chism
Kimball Electronics



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