Hi Michel!

If you send the picture directly to me,
I can post it on my web page for all to see.

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX



|---------+------------------------------>
|         |           "Arbour, Michel"   |
|         |           <[log in to unmask]
|         |           ONTRON.COM>        |
|         |           Sent by: TechNet   |
|         |           <[log in to unmask]>  |
|         |                              |
|         |                              |
|         |           06/08/2005 08:47 AM|
|         |           Please respond to  |
|         |           TechNet E-Mail     |
|         |           Forum; Please      |
|         |           respond to "Arbour,|
|         |           Michel"            |
|         |                              |
|---------+------------------------------>
  >--------------------------------------------------------------------------------------------------------------|
  |                                                                                                              |
  |       To:       [log in to unmask]                                                                              |
  |       cc:                                                                                                    |
  |       Subject:  [TN] Solderability issues with ENIG finish                                                   |
  >--------------------------------------------------------------------------------------------------------------|




> Hi ,
> We've been having some solderability problems with one of our supplier. A
> populated PCB was sent for elementary analysis and we got the results
back
> from the lab.
> Before going further in the corrective action process i would like to
know
> if some of you agree and support the conclusions of the report based on
> the following data.
>
> - The board sent to analysis was populated , one half of a smt pad  did
> not wet with solder the other half wetted properly
> - The problem was noticeable on approx. 2% of the lot of PCB. 2-3 pads
per
> board
> - The pad could not be soldered using an iron pen
> - Solder paste is standard Sn63, Pb37
>
> Two area on the pad were analyzed, one that was wetted , the other was
> not.
> Concentrations of element found  were the following
> - On the wetted area of the pad ALIAS : "AREA B"
> 5.40% C
> 2.04% N
> 0.81% O
> 45.32% Sn
> 2.45% Ni
> 3.67% Cu
> 40.31% Pb
>
> On the unsolderable area of the pad ALIAS "AREA A"
> 6.08% C
> 9.08% P
> 9.55% Sn
> 66.62% Ni
> 3.47% Cu
> 5.20% Au
>
> The conclusion of the report states :
> Area A is a fracture surface at the intermetallic boundary while Area B
is
> a fracture surface at or near the bulk solder.  No mud cracking is seen
at
> Area A which indicates that black nickel was most likely not present.
The
> fact that there is a fairly large gold peak at area A indicates that
there
> may not have been sufficient time to adequately form the solder joint as
> the gold may not have had time to diffuse into the bulk solder.
>
> I can post a picture of the pad if you can point me to a location
>
>
> Michel Arbour
> Kontron Canada Inc.
>

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