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June 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Tue, 7 Jun 2005 09:02:15 +0200
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Thanks Steve,
a guidance: the pics show (increasing magnification)ENIG gold with varying bondability. Heavy wire Al wedge U/S worked, but fine wire ball bonding did not. The reason was that small areas had a gold with insufficient adhesion to the underlying nickel, resulting in bond lifts whatever machine parameters we used. With a naked eye, the boards looked quite normal, ligth microscopy did not disguise the cause either. As I said, Roger Massey helped me that time. Has he left TN?
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stephen Gregory
Sent: den 3 juni 2005 20:52
To: [log in to unmask]
Subject: Re: [TN] Residue on bondable gold?


Hi All!

Was a little tardy getting these pictures up, but this morning
Inge sent me some really nice SEM images of residues on
bondable gold. Go to:

http://www.stevezeva.homestead.com

Look at; "Gold Residues, Gold Residues 2,3, and 4".

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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