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June 2005

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Subject:
From:
Şefika ÖZKAL <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Şefika ÖZKAL <[log in to unmask]>
Date:
Mon, 6 Jun 2005 11:59:44 +0300
Content-Type:
text/plain
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text/plain (49 lines)
Hi,

Will it make a problem to assemle a lead free component to pcb with finish
type hot air solder levelling (which consists of pb) and while using solder
with pb?

I am asking the question as a designer. I could not give the solder
composition used while finishing the pcb and used while assembling.
However if the information is needed I will try to find.

Regards

Sefika OZKAL
Design Enginneer

MGEO Division
ASELSAN INC.




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