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June 2005

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Subject:
Re: Is wire bonding reflowable?
From:
Joyce Koo <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 30 Jun 2005 14:59:59 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (98 lines) 
if it is JEDEC qualified module, it should be no difference than any other
module you use in the process.  (the lid seal should be good enough for the
standard water wash... if it is MEMS module, might have a sensor chip open
to the outside, you may be out of luck... without knowning anything in
detail, no comment... I do not want to know anything in detail at all... if
it is such a case, you may want call someone who is in the consulting
business).
                                   jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
Sent: Thursday, June 30, 2005 2:52 PM
To: [log in to unmask]
Subject: Re: [TN] Is wire bonding reflowable?


Joyce,

What about washing? It is on water soluble.

Thanks,
Ioan

> -----Original Message-----
> From: Joyce Koo [SMTP:[log in to unmask]]
> Sent: Thursday, June 30, 2005 2:35 PM
> To:   TechNet E-Mail Forum; Tempea, Ioan
> Subject:      RE: [TN] Is wire bonding reflowable?
>
> if it is a module, I assume it has a lid to protect the wire bond.  If it
> the module is JEDEC format, you should not worry.  JEDEC calls for 3 times
> reflow at either lead free or standard eutectic temperature for device
> qualification.
> Good luck.
>                                 jk
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
> Sent: Thursday, June 30, 2005 10:49 AM
> To: [log in to unmask]
> Subject: [TN] Is wire bonding reflowable?
>
>
> Hi Technetters,
>
> a customer of ours is wondering if a module they are ordering will be OK
to
> solder in regular (SnPb for now) reflow. The module has an exposed die, no
> encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
> regular ICs can be reflowed with no issue, this module should not present
> any hickup.
>
> My exposure to wire bonding is zero, so I take this issue with you. Can
this
> question be answered as is, or would you need more details?
>
> Thanks,
> Ioan
>
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