Joyce,
What about washing? It is on water soluble.
Thanks,
Ioan
> -----Original Message-----
> From: Joyce Koo [SMTP:[log in to unmask]]
> Sent: Thursday, June 30, 2005 2:35 PM
> To: TechNet E-Mail Forum; Tempea, Ioan
> Subject: RE: [TN] Is wire bonding reflowable?
>
> if it is a module, I assume it has a lid to protect the wire bond. If it
> the module is JEDEC format, you should not worry. JEDEC calls for 3 times
> reflow at either lead free or standard eutectic temperature for device
> qualification.
> Good luck.
> jk
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
> Sent: Thursday, June 30, 2005 10:49 AM
> To: [log in to unmask]
> Subject: [TN] Is wire bonding reflowable?
>
>
> Hi Technetters,
>
> a customer of ours is wondering if a module they are ordering will be OK to
> solder in regular (SnPb for now) reflow. The module has an exposed die, no
> encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
> regular ICs can be reflowed with no issue, this module should not present
> any hickup.
>
> My exposure to wire bonding is zero, so I take this issue with you. Can this
> question be answered as is, or would you need more details?
>
> Thanks,
> Ioan
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
