if it is a module, I assume it has a lid to protect the wire bond.  If it
the module is JEDEC format, you should not worry.  JEDEC calls for 3 times
reflow at either lead free or standard eutectic temperature for device
qualification.
Good luck.
                                jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
Sent: Thursday, June 30, 2005 10:49 AM
To: [log in to unmask]
Subject: [TN] Is wire bonding reflowable?


Hi Technetters,

a customer of ours is wondering if a module they are ordering will be OK to
solder in regular (SnPb for now) reflow. The module has an exposed die, no
encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
regular ICs can be reflowed with no issue, this module should not present
any hickup.

My exposure to wire bonding is zero, so I take this issue with you. Can this
question be answered as is, or would you need more details?

Thanks,
Ioan

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