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June 2005

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Thu, 30 Jun 2005 14:14:27 -0400
Content-Type:
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        In a previous life I was involved with wire bonding. It is usually done with  gold or silver wire the size of hair, that is ultrasonically imbedded onto a surface first and then the other connecting surface, after which the wire is cut.  The wires are very fragile. It takes grams of  force to break them. I cannot picture wire bonded unprotected exposed to the environment while in service. 
        Regards,
        Ramon

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Blomberg, Rainer
(FL51)
Sent: Thursday, June 30, 2005 12:10 PM
To: [log in to unmask]
Subject: Re: [TN] Is wire bonding reflowable?


I'm confused...isn't wire bonding actually a weld? Are we talking about IC
leads or die wire bonds? I suppose a weld can be "re-welded" but reflow is
not the right term.  If you mean reflow of a solder joint, that would apply
to the leads of the IC, but wires from a die are usually not soldered,
rather wire bonded (welded).  If the die could be protected from the
process, reflow could be performed.

-----Rainer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glenn Pelkey
Sent: Thursday, June 30, 2005 11:10 AM
To: [log in to unmask]
Subject: Re: [TN] Is wire bonding reflowable?

Hi Ioan,

With exposed die and wire bonds, I would say no for production.  Maybe they
need it for a prototype...

Risk are, flux contamination, solder balls, handling damage.  The reflow
temperature itself is not a problem, just everything that goes with it.

Glenn

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, June 30, 2005 7:49 AM
To: [log in to unmask]
Subject: [TN] Is wire bonding reflowable?


Hi Technetters,

a customer of ours is wondering if a module they are ordering will be OK to
solder in regular (SnPb for now) reflow. The module has an exposed die, no
encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
regular ICs can be reflowed with no issue, this module should not present
any hickup.

My exposure to wire bonding is zero, so I take this issue with you. Can this
question be answered as is, or would you need more details?

Thanks,
Ioan

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