Rainer,
you're right, I was confusing. The die is on an FR4 PCB, together with a few passives, this being a module. The module has to be soldered, just like any regular SMT component on a PCB.
It occurs to me more and more that this soldering on the PCB is not an issue, but the cleaning is. I will recommend encapsulation of the die prior to any subsequent handling and soldering.
Thanks,
Ioan
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Blomberg, Rainer (FL51)
> Sent: Thursday, June 30, 2005 12:10 PM
> To: [log in to unmask]
> Subject: Re: [TN] Is wire bonding reflowable?
>
> I'm confused...isn't wire bonding actually a weld? Are we talking about IC
> leads or die wire bonds? I suppose a weld can be "re-welded" but reflow is
> not the right term. If you mean reflow of a solder joint, that would apply
> to the leads of the IC, but wires from a die are usually not soldered,
> rather wire bonded (welded). If the die could be protected from the
> process, reflow could be performed.
>
> -----Rainer
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Glenn Pelkey
> Sent: Thursday, June 30, 2005 11:10 AM
> To: [log in to unmask]
> Subject: Re: [TN] Is wire bonding reflowable?
>
> Hi Ioan,
>
> With exposed die and wire bonds, I would say no for production. Maybe they
> need it for a prototype...
>
> Risk are, flux contamination, solder balls, handling damage. The reflow
> temperature itself is not a problem, just everything that goes with it.
>
> Glenn
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
> Sent: Thursday, June 30, 2005 7:49 AM
> To: [log in to unmask]
> Subject: [TN] Is wire bonding reflowable?
>
>
> Hi Technetters,
>
> a customer of ours is wondering if a module they are ordering will be OK to
> solder in regular (SnPb for now) reflow. The module has an exposed die, no
> encapsulation, wire bonded to gold pads on an FR4 substrate. For me, since
> regular ICs can be reflowed with no issue, this module should not present
> any hickup.
>
> My exposure to wire bonding is zero, so I take this issue with you. Can this
> question be answered as is, or would you need more details?
>
> Thanks,
> Ioan
>
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